EDCC

Introducing the Compact High-Power LED EDCC Family Release

Marubeni America Corporation (hereafter referred to as MAC) is proud to announce the development of a new high-power LED package called the "EDCC Family," designed with a focus on compactness and high-density integration. Production of the EDCC Family is set to commence in the first quarter of 2024.

The EDCC Family incorporates traditional high-power LED chips with a wide range of wavelength options, yet it achieves an impressive reduction in footprint of approximately 80% when compared to the previous small-sized EDC Family package. As a result, it offers a compact form factor (W1.5 x L1.85 x H0.9 mm) that closely resembles bare chips and is also compatible with CSP (Chip Scale Package) and other compact-sized packages. This ensures not only ease of customization but also the convenience of handling SMD (Surface Mount Device) packages.

Key Features:

Utilizes high-power LED chips with a wide wavelength range, including UV, visible light, IR, and SWIR, similar to those used in the SMBB Family and EDC Family.

Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.

Package design optimized for high-density integration.

Applications:

The EDCC Family is suitable for a wide range of applications that require high brightness, high output, and the combination of multiple wavelengths, including but not limited to:

  • Machine Vision
  • Optical Sorting
  • Plant Growth
  • Security
  • Surveillance Cameras
  • Optical Authentication
  • Inspection Equipment
  • Vital Sensing and more.

Comparison with conventional products

SMBB Flat

EDC Flat

EDCC

Package area(mm)

5.0×5.2

3.5×3.5

1.5×1.85
(80% reduction compared to EDC Family)

Appearance

Comparison

SMBB850DS-1100

EDC850DS-1100

EDCC850DS-1100

 Vf[V]@1A

3.2

3.2

3.2

 Vfp[V]@5A*

4.6

4.6

4.6

 Po[W]@1A

1.4

1.4

1.2

 Po[W]@5A*

5.6

5.6

5.3

 Rthjs[K/W]

9

11

21

 φ1/2[deg.]

64

66

Long**

69

Short**

66

*Pulse Condition: On Time 10us, Duty 1%

**Radiation Characteristics of EDCC Package

 

Package Design Optimized for High-Density Integration

The EDCC Family features a package design specifically tailored for high-density integration.

When EDCC packages are arranged in a 2 x 2 configuration, they fit within a compact 4mm x 3.2mm footprint, offering a package size nearly equivalent to the EDC package. Even when arranged in a 2 x 3 configuration, the total footprint remains compact at 4mm x 4.9mm, surpassing the SMBB package in terms of package area efficiency.

Example of LED placement

Recommended Land Pattern/Metal Mask Aperture Pattern

Release Date

Category Range Release Date
UV 365nm - 420nm TBD
Visible 430nm - 680nm 2024 1Q
NIR 690nm - 980nm 2024 1Q
SWIR 1050nm - 1900nm 2024 1Q

Engineering Sample List

Single Junction Type

Wavelength Product Code
670nm EDCC670D-1100-X
700nm EDCC700D-1100-X
720nm EDCC720D-1100-X
740nm EDCC740D-1100-X
760nm EDCC760D-1100-X
780nm EDCC780D-1100-X
810nm EDCC810D-1100-X
850nm EDCC850D-1100-X
890nm EDCC890D-1100-X
910nm EDCC910D-1100-X
940nm EDCC940D-1100-X
970nm EDCC970D-1100-X
1050nm EDCC1050GD-1100-X
1070nm EDCC1070D-1100-X
1100nm EDCC1100D-1100-X
1150nm EDCC1150D-1100-X
1200nm EDCC1200D-1100-X
1300nm EDCC1300D-1100-X
1370nm EDCC1370D-1100-X
1450nm EDCC1450D-1100-X
1550nm EDCC1550D-1100-X
1650nm EDCC1650D-1100-X
1900nm EDCC1900D-1100-X

 

 

Dual Junction Series

Wavelength Model
810nm EDCC810DS-1100-X
850nm EDCC850DS-1100-X
890nm EDCC890DS-1100-X
940nm EDCC940DS-1100-X
970nm EDCC970DS-1100-X

* Models with "-X" in their part numbers are exclusive to prototypes and engineering samples, and the part numbers will change for mass production.

* Please note that this product is under development and may be subject to changes and modifications without prior notice.

Product and Engineering Sample Inquiries

We have a limited quantity of engineering samples available for the EDCC package.

For inquiries, please click here.