Introducing the Compact High-Power LED EDCC Family Release

Marubeni America Corporation (hereafter referred to as MAC) is proud to announce the development of a new high-power LED package called the "EDCC Family," designed with a focus on compactness and high-density integration. Production of the EDCC Family is set to commence in the first quarter of 2024.

The EDCC Family incorporates traditional high-power LED chips with a wide range of wavelength options, yet it achieves an impressive reduction in footprint of approximately 80% when compared to the previous small-sized EDC Family package. As a result, it offers a compact form factor (W1.5 x L1.85 x H0.9 mm) that closely resembles bare chips and is also compatible with CSP (Chip Scale Package) and other compact-sized packages. This ensures not only ease of customization but also the convenience of handling SMD (Surface Mount Device) packages.

Key Features:

・Utilizes high-power LED chips with a wide wavelength range, including UV, visible light, IR, and SWIR, similar to those used in the SMBB Family and EDC Family.

・Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.

・Package design optimized for high-density integration.

Applications:

The EDCC Family is suitable for a wide range of applications that require high brightness, high output, and the combination of multiple wavelengths, including but not limited to:

• Machine Vision
• Optical Sorting
• Plant Growth
• Security
• Surveillance Cameras
• Optical Authentication
• Inspection Equipment
• Vital Sensing　and more.

Comparison with conventional products

	SMBB Flat	EDC Flat	EDCC
Package area(mm)	5.0×5.2	3.5×3.5	1.5×1.85 (80% reduction compared to EDC Family)
Appearance

Comparison

*Pulse Condition: On Time 10us, Duty 1%

**Radiation Characteristics of EDCC Package

Package Design Optimized for High-Density Integration

The EDCC Family features a package design specifically tailored for high-density integration.

When EDCC packages are arranged in a 2 x 2 configuration, they fit within a compact 4mm x 3.2mm footprint, offering a package size nearly equivalent to the EDC package. Even when arranged in a 2 x 3 configuration, the total footprint remains compact at 4mm x 4.9mm, surpassing the SMBB package in terms of package area efficiency.

Example of LED placement

Recommended Land Pattern/Metal Mask Aperture Pattern

Release Date

Engineering Sample List

Single Junction Type

Dual Junction Series

* Models with "-X" in their part numbers are exclusive to prototypes and engineering samples, and the part numbers will change for mass production.

* Please note that this product is under development and may be subject to changes and modifications without prior notice.

Product and Engineering Sample Inquiries

We have a limited quantity of engineering samples available for the EDCC package.

For inquiries, please click here.