Surface Mount LED

[:en]SMD LEDs: Surface Mount Device or “Chips” utilizing leaded or lead-less package styles was another innovation in LED package styles. This type of package did not require PTHs. Plastic Leaded Chip Carriers are popular with sizes based on surface mount electronic formats such as chip capacitors. This format was also incorporated into devices with more than 1 LED die, including 3-die RGB formats with 4 I/O. With the advent of chip-scale packaging, which is a leadless SMD format particularly utilized for Power LEDs, back-side solder pads are used for I/O, as well as a “thermal pad” that transfers the heat to the PCB, with the PCB typically having a number of PTH used for thermal purposes of transferring the generated heat to the backside of the PCB.

Mid-Power LEDs: This style LED typically utilizes a SMD format. It is based on 500 x 500 micron or similar sized die, usually 1 die/package.

High Power LEDs: This style LED typically utilizes a SMD format. It is based on 1000 x 1000 micron or similar sized die, usually 1 die/package.

Marubeni’s SMBB850DS-1100-02 (wavelength 850nm, viewing angle +/- 10 deg) gives the highest performance for ALPR /ANPR (Automatic number-plate recognition) System.[:cn]表面黏着 LED：采有铅或无铅封装的表面黏着型装置，又称为“晶片”，是 LED 封装的又一创新，此类型的封装不需要 PTH。有引脚晶片塑胶承载体十分受欢迎，并有以表面黏着电子布局（如晶片电容器）为基础的各种尺寸。此种布局另外结合超过 1 个 LED 晶粒的装置，包括有 4 个 I/O 的 3 晶粒 RGB 布局。随着晶片尺寸封装（即功率 LED 专用的无铅表面黏着布局）的进步，不仅背面焊垫会用于 I/O，亦有使用将热传导至印刷电路板的“散热垫”。印刷电路板则通常有一定数量的 PTH，用来将产生的热传导至印刷电路板的背面。

中功率 LED：这类型的 LED 通常采用表面黏着布局，以 500 x 500 微米或类似尺寸的晶片为基础打造，通常采用 1 晶片/封装。

高功率 LED：此类型的 LED 通常采用表面黏着布局，以 1000 x 1000 微米或类似尺寸的晶片为基础打造，通常采用 1 晶片/封装。[:]