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Chip-Level IR & NIR LEDs — Bare Die for Custom Arrays
Our infrared LED bare die are the building blocks for
bespoke sensor modules and high-density illuminators. Supplied on UV tape
with optional AuSn or AuGe back metallisation, these NIR LED chips
cover 730 nm – 940 nm and drive currents up to 1 A/mm². Designers can wire-bond
or flip-chip onto metal-core PCBs to create custom linear bars, ring lights,
or stacked emitters that outperform off-the-shelf packages.
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