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If you’ve browsed the Tech-LED / Marubeni catalog, you’ve likely seen part numbers like SMBB850DS1-100S-02Z-I and wondered what each segment means. This guide shows you how to decode Marubeni LED part numbers – so engineers and purchasing teams can understand package type, wavelength, chip configuration, and options at a glance.
Anatomy of a Marubeni LED Part Number
Each part number follows a consistent pattern. Here’s how to read a typical example:
Example: SMBB850DS1-100S-02Z-I
Code
Segment
Meaning
(a)
Package Family Name — identifies the LED package type (e.g., SMBB, SMT, EDC, COB, STEM).
(b)
850
Peak Wavelength (nm) — emission wavelength in nanometers; typically 365 nm (UV) to 1900 nm (SWIR).
(c)
DS
Chip Structure Type — internal chip structure designation (e.g., DS). Not user-selectable.
(d)
1
Number of Chips — 1 (single), 2 (dual), 3 (triple).
(e)
100
Chip Dimension — in microns; “100” = 1000 µm × 1000 µm, “130” = 1300 µm × 1300 µm, etc.
(f)
S
Internal Circuit Type (multi-chip) — e.g., S = series, P = parallel.
(g)
-02
Lens Type — none = flat lens, -02 = 02 lens, -03 = 03 lens, -05 = 05 lens.
(h)
Z
Zener Diode Option — “Z” indicates an integrated Zener diode for ESD protection.
(i)
-I
Ceramic Insulator Option — available for multi-chip lamps to enhance thermal/electrical isolation.
Quick Reference (Common Segments)
Code
Definition
Example
SMBB
High-power SMD package family
SMBB850DS1-100S-02Z-I
EDC
Compact high-power LED (EDC series)
EDC405ES1-130S-05Z
COB
Chip-on-Board LED
COB395DS2-100S
STEM
Stem-type package LED
STEM660DS1-130S
365
Peak wavelength: 365 nm (UV)
SMT365ES1-100S
850
Peak wavelength: 850 nm
SMBB850DS1-100S-02Z
100
Chip size: 1000 µm × 1000 µm
COB660DS1-100S
-02
Lens type “02”
SMBB850DS1-100S-02Z
Z
With Zener diode
EDC405ES1-100S-05Z
-I
With ceramic insulator (multi-chip)
SMBB850DS1-100S-02Z-I
Example Variants Across Packages
Family
Example Part
Common Use
SMBB
SMBB850DS1-100S-02Z-I
High-power surface-mount emitters
EDC
EDC405ES1-130S-05Z
Compact high-power UV sources
COB
COB395DS2-100S
Chip-on-Board area/flood applications
STEM
STEM660DS1-130S
Visible LEDs for sensors/instrumentation
Why This Numbering System Matters
- Faster selection: identify wavelength, package, chip count, and lens at a glance.
- Design efficiency: match package and thermal needs across families.
- Accurate procurement: engineers and buyers can specify the exact same LED variant.
Related Resources
- Through-Hole LEDs
- Surface-Mount LEDs – SMT
- Surface-Mount LEDs – SMBB
- High-Power EDC Series
- High-Power Illuminator / TO-66 / Array
- COB (Chip-on-Board) LEDs
- UV & Near-UV LEDs (235–420 nm)
- Visible LEDs (400–800 nm)
- Photodiodes
- Two-Tone Photodiodes
FAQ
What do Marubeni LED part numbers mean?
They encode the package family, peak wavelength, chip structure, number of chips, chip dimensions, internal circuit (for multi-chip), lens type, and options (e.g., Zener diode, ceramic insulator).
How can I identify the wavelength from the code?
The three-digit number after the package family (e.g., 850) indicates the peak wavelength in nanometers. For UV, you might see values like 365, 385, 395, 405, etc.
What does the “Z” indicate?
Z indicates the product includes a Zener diode for electrostatic discharge (ESD) protection.
When does “-I” appear in the part number?
-I marks the ceramic insulator option, typically used in multi-chip lamps for enhanced thermal and electrical isolation.
Related Articles
- LED Package Types Explained: SMT vs. SMBB vs. COB
- Understanding LED Wavelengths and Applications
- How to Choose the Right LED for Industrial & Medical Devices
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